FLIR A50 Thermal Imaging Research & Development Kit

Availability: In Stock / Short Lead Time
£6,199.00

The FLIR A50 Research & Development Kit offers a cost-effective solution for thermal imaging analysis in electronics testing and R&D. It provides accessible tools for examining crucial thermal patterns, empowering researchers to delve into thermal behavior, make informed decisions, and drive innovation with its user-friendly interface and versatile functionality.

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The FLIR A50/A70 Research & Development Kits provide affordable and accessible solutions for analysing thermal imaging in proof-of-concept electronics testing and R&D applications.

Accuracy & Efficiency

  • Achieve precise temperature measurements with a remarkable thermal resolution of up to 161,472 measurement pixels (640 × 480 resolution) and an impressive accuracy of ±2°C
  • Expedite the detection of previously unidentified thermal anomalies through high-quality infrared imagery
  • Leverage FLIR's powerful MSX® technology to gain a greater understanding of thermal image data

Work Faster AND Smarter

  • Seamlessly stream complete radiometric image data using standard Gigabit Ethernet or Wi-Fi connections
  • Conduct both qualitative and quantitative thermal analysis effortlessly using FLIR Research Studio software
  • Simultaneously compare and scrutinise thermal data from multiple connected cameras and recorded data files

Pocket-Sized Reliability

  • M-style connectors and standard IP66 protection ensure accuracy and smooth operation in even the toughest of environments
  • Effortlessly install this compact camera in any desired location, thanks to varied mounting options
  • Streamline your setup by eliminating the need for multiple cables using Power over Ethernet and included Wi-Fi connectivity

Find more information.

For expert advice and pricing, please get in touch with us at 0800 583 4455 or sales@sjelectronics.co.uk

IR Resolution 464 x 348 pixels
Detector Pitch 17 µm
Spectral Range 7.5-14.0 µm
Detector Type Uncooled microbolometer
Dynamic Range 16-bit
Thermal Sensitivity/NETD <50 mK
Frame Rate 30 Hz
Standard Temperature Range -20°C to 175°C (-4°F to 347°F); 175°C to 1000°C (347°F to 1832°F)
Focus Adjustable with included focus tool

 

Imaging & Optical

Available Lenses Fixed lens only
Detector Pitch 17 µm
Detector Type Uncooled microbolometer
Digital Data Streaming to PC Via workstation running included Research Studio Software
Dynamic Range 16-bit
Field of View (FOV) 29° x 22°
Focus Adjustable with included focus tool
Frame Rate 30 Hz
Image Modes Thermal, visual, MSX®, FSX®
IR Resolution 464 x 348 pixels
Lens 29°
Lens Identification None
Macro Mode No
Minimum Focus Distance
025m
Spectral Range 7.5-14.0 µm
Thermal Sensitivity/NETD <50 mK
Visible Camera Included, 1280 x 960 resolution

 

Measurement & Analysis

Accuracy ±2°C (±3.6°F or ±2% of reading for ambient temperature 15°C to 35°C (59°F to 95°F), object temperature above 0°C (32°F)
Standard Temperature Range -20 °C to 175°C (-4°F to 347°F); 175°C to 1000°C (347°F to 1832°F); 300°C to 1500°C (572°F to 2732°F)

 

Communication & Data Storage

Command and Control Gigabit Ethernet (RTSP, GigE Vision
Digital I/O connector type M12 Male 12-pin A-coded (shared with ext. power)
Digital I/O isolation voltage 500 VRMS
Digital Inputs 2 x  opto-isolated, Vin (low) = 0–1.5 V, Vin (high) = 3–25V
Digital Outputs 3 x  opto-isolated, 0–48 VDC, max. 350 mA (derated to 200 mA at 60°C). Solid-state opto relay, 1× dedicated as fault output (NC)
Ethernet Communication GigE Vision ver. 1.2, Client API GenICam compliant, TCP/IP socket-based (FLIR proprietary)
Ethernet Connector Type M12 8-pin X-coded, female
Ethernet Image Streaming Yes
Ethernet Power Power over Ethernet, PoE IEEE 802.3af class 3
WiFi
Yes, Female RP-SMA connector; Peer to peer (ad hoc) or Infrastructure (network)

 

General

Size [L x W x H] w Lens
107 x 67 x 57mm, without bottom cooling plate

 

Power

External Voltage 24/48 V DC, 8 W max
Power Cable Configuration Power over Ethernet or External
Power Connection M12 Male 12-pin A-coded (shared with Digital I/O)

 

Environment & Certifications

Encapsulation IEC 60529 and IP66
Mounting 1/4-20 UNC depth 7mm + Ø5 depth 2.7 mm
Operating Temperature -20°C to 50°C (-4°F to 113°F), with included cooling plate, Maximum camera case temperature: 65°C (149°F)
Shock IEC 60068-2-27, 25 g
Storage Temperature Range IEC 68-2-1 and IEC 68-2-2, -40°C to 70°C (-40°F to 158°F) for 16 hours
Vibration IEC 60068-2-6, 0.15 mm at 10 Hz to 58 Hz and 2 g at 58 Hz to 500 Hz, Sinusoidal IEC 61373 Cat 1 (Railway)